Apparatus and method for attaching an integrating circuit...

Details Apparatus and method for attaching an integrating circuit... Apparatus and method for attaching an integrating circuit...

2007-07-17

2007-07-17

Pham, Thanhha S. (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With housing or contact structure

C257S726000, C257S727000

Reexamination Certificate

active

10889725

ABSTRACT:
A method of fabricating an integrated circuit sensor package. The method comprises the steps of: 1) mounting a substrate on a first mold block, the substrate comprising a substantially planar material having a first substrate surface and a second substrate surface that contacts a mounting surface of the first mold block; 2) placing an adhesive on the first substrate surface; 3) placing an integrated circuit sensor on the adhesive; and 4) pressing a second mold block against the first substrate surface. The second mold block comprising a cavity portion for receiving the integrated circuit sensor, a contact surface surrounding the cavity portion, and a compliant layer mounted with the cavity portion. Pressing the second mold block against the first substrate surface causes the contact surface to form with the first substrate surface a seal surrounding the integrated circuit sensor. Pressing also causes the compliant layer to press against a sensor array surface of the integrated circuit sensor, thereby pressing the integrated circuit sensor into the adhesive and the first substrate surface.

REFERENCES:
patent: 6191359 (2001-02-01), Sengupta et al.
patent: 6686227 (2004-02-01), Zhou et al.
patent: 2002/0088632 (2002-07-01), Salatino et al.
patent: 2003/0148556 (2003-08-01), Zhou et al.
patent: 2003/0214021 (2003-11-01), Zhou et al.

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