Integrated sensor and electronics package

Details Integrated sensor and electronics package Integrated sensor and electronics package

2005-05-10

2005-05-10

Nelms, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

C257S704000, C257S710000, C257S774000, C073S756000, C361S761000, C264S161000

Reexamination Certificate

active

06891239

ABSTRACT:
An integrated sensor and electronics package wherein a micro-electromechanical sensor die is bonded to one side of the package substrate, one or more electronic chips are bonded to an opposite side of the package substrate, internal electrical connections run from the sensor die, through the package substrate, and to the one or more electronic chips, and input/output connections on the package substrate are electrically connected to one or more of the electronic chips.

REFERENCES:
patent: 6333856 (2001-12-01), Harju
patent: 6401545 (2002-06-01), Monk et al.
patent: 6528875 (2003-03-01), Glenn et al.
patent: 6633385 (2003-10-01), Trepanier

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