4. Electric heating
  5. Heating devices
  6. Combined with container, enclosure, or support for material...

Theodore P. Lopez

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Bump chip scale semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Distress call emitting device

Communications: electrical – Condition responsive indicating system – Specific condition
Patent

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Method and structure for controlling plasma uniformity

Etching a substrate: processes – Gas phase etching of substrate – Application of energy to the gaseous etchant or to the...
Patent

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System and apparatus for in situ monitoring and control of annea

Electric heating – Heating devices – Combined with container – enclosure – or support for material...
Patent

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Profile ID: LFUS-PAI-P-1160803

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