4. Alloys or metallic compositions
  5. Tin base
  6. Antimony, or bismuth containing

Tetsuya Nakatsuka

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Electron device and semiconductor device

Alloys or metallic compositions – Tin base – Copper containing
Reexamination Certificate

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Electronic component with varying rigidity leads using...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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Electronic device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Electronic device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Lead-free solder used for connecting electronic parts on organic

Alloys or metallic compositions – Tin base – Antimony – or bismuth containing
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Profile ID: LFUS-PAI-P-692057

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