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2006-07-11

2006-07-11

Andújar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S779000

Reexamination Certificate

active

07075183

ABSTRACT:
Each of junctions formed between a semiconductor device and a substrate comprises metal balls of Cu etc. and compounds of Sn and the metal balls, and the metal balls are bonded together by the compounds.

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So, William et al., High Temperature Joints Manufactured at Low Temperature, IEEE, Jun. 1998, pp. 284-291, 1998 Electronic Components and Technology Conference.

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