Electronic component with varying rigidity leads using...

Details Electronic component with varying rigidity leads using... Electronic component with varying rigidity leads using...

2011-03-22

2011-03-22

Richards, N Drew (Department: 2895)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S665000, C257S669000, C257S672000, C257S674000, C257S677000, C257S678000, C257S735000, C257S775000, C257SE23010, C257SE23031, C257SE23043

Reexamination Certificate

active

07911062

ABSTRACT:
The present invention proposes a semiconductor device including a semiconductor chip having a plurality of electrodes, a plurality of leads electrically connected to the plurality of electrodes of the semiconductor chip by bonding wires, and a resin for implementing the semiconductor chip, wherein the plurality of leads are comprised of two or more kinds of leads having different rigidities.

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Japanese Office Action dated Mar. 23, 2010.

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