4. Material or article handling
  5. Load carried along a horizontal linear path
  6. Carried via magnetic floating

Tetsuji Kadowaki

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Apparatus for conveyance of semiconductor chips

Material or article handling – Load carried along a horizontal linear path – Carried via magnetic floating
Reexamination Certificate

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Apparatus for manufacturing bonded substrate

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Automatic and/or material-triggered control
Reexamination Certificate

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Apparatus for manufacturing bonded substrate

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Presses or press platen structures – per se
Reexamination Certificate

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Apparatus for manufacturing bonded substrate

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With work feeding or handling means
Reexamination Certificate

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Method for manufacturing bonded substrate

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2467353

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