Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With work feeding or handling means
Reexamination Certificate
2006-05-05
2009-11-24
Koch, III, George R (Department: 1791)
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
With work feeding or handling means
C156S360000, C156S367000, C156S382000, C156S381000
Reexamination Certificate
active
07621310
ABSTRACT:
The present invention provides an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together and accurately aligned.
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Machine translation of JP 2000-284295.
Hashizume Koji
Hatano Norihiko
Kadowaki Tetsuji
Miyajima Yoshimasa
Fujitsu Limited
Greer Burns & Crain Ltd.
Koch, III George R
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