Apparatus for manufacturing bonded substrate

Details Apparatus for manufacturing bonded substrate Apparatus for manufacturing bonded substrate

2006-08-29

2006-08-29

Koch, George (Department: 1734)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Automatic and/or material-triggered control

C156S360000, C156S367000, C156S382000, C156S381000

Reexamination Certificate

active

07096911

ABSTRACT:
The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.

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Machine translation of JP 2000-284295 (reference submitted in Sep. 14, 2005 IDS).

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