4. Registers
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Tetsuichiro Kasahara

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IC card, antenna for IC card, and antenna frame therefor

Registers – Records
Reexamination Certificate

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Lead frame, method of manufacturing the same, and method of...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Lead frame, method of manufacturing the same, and method of...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Method of manufacturing a plane coil

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Process for manufacturing IC card

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2648398

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