Lead frame, method of manufacturing the same, and method of...

Details Lead frame, method of manufacturing the same, and method of... Lead frame, method of manufacturing the same, and method of...

2007-08-21

2007-08-21

Le, Thao P. (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S111000, C438S106000, C257S666000, C257S673000

Reexamination Certificate

active

11020036

ABSTRACT:
In a method of manufacturing a lead frame for use in a leadless package such as a quad flat non-leaded package (QFN), a base frame is first formed which includes a region for resin-molding a plurality of semiconductor elements to be mounted on one surface of the base frame, the region being partitioned into land shapes, and in which a die-pad portion and lead portions around the die-pad portion are defined severally for the individual semiconductor elements to be mounted in each of the partitioned regions for resin-molding. Next, an adhesive tape is attached to the other surface of the base frame, and subsequently a cut portion is provided at a portion corresponding to a region between two adjacent partitioned regions for resin-molding, of the adhesive tape.

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Japanese Patent Office Action for corresponding Japanese Patent Application No. 2001-328528 dated Mar. 29, 2005 with partial translation.

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