Lead frame, method of manufacturing the same, and method of...

Details Lead frame, method of manufacturing the same, and method of... Lead frame, method of manufacturing the same, and method of...

2005-04-05

2005-04-05

Niebling, John F. (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S112000, C438S113000, C438S123000, C438S124000

Reexamination Certificate

active

06875630

ABSTRACT:
In a method of manufacturing a lead frame for use in a leadless package such as a quad flat non-leaded package (QFN), a base frame is first formed which includes a region for resin-molding a plurality of semiconductor elements to be mounted on one surface of the base frame, the region being partitioned into land shapes, and in which a die-pad portion and lead portions around the die-pad portion are defined severally for the individual semiconductor elements to be mounted in each of the partitioned regions for resin-molding. Next, an adhesive tape is attached to the other surface of the base frame, and subsequently a cut portion is provided at a portion corresponding to a region between two adjacent partitioned regions for resin-molding, of the adhesive tape.

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patent: 6515356 (2003-02-01), Shin et al.
patent: 6630374 (2003-10-01), Yamamoto
patent: 6709892 (2004-03-01), Kobayakawa et al.
patent: 20040106235 (2004-06-01), Igarashi et al.
patent: 10-12773 (1998-01-01), None

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