Integrated circuit package incorporating low-stress omnidirectio

Details Integrated circuit package incorporating low-stress omnidirectio Integrated circuit package incorporating low-stress omnidirectio

1985-07-15

1986-09-09

Edlow, Martin H.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

174 16HS, H01L 2336

Patent

active

046112383

ABSTRACT:
Disclosed is a heat sink for cooling an integrated circuit package. The heat sink comprises a single thin sheet of material having two oppositely facing major surfaces. These two major surfaces have a common perimeter defining a plurality of spaced-apart finger-shaped portions of the thin sheet of material that extend radially from a central portion of the sheet. The central portion is convex for attachment to the integrated circuit package; and the finger-shaped portions are formed to extend out of the plane of the central portion to become cooling fins for the central portion.

REFERENCES:
patent: 2712102 (1955-06-01), Bacon
patent: 2713655 (1955-07-01), Grubman
patent: 2897419 (1959-07-01), Howland et al.
patent: 3195628 (1965-07-01), McAdam
patent: 3212569 (1965-10-01), McAdam
patent: 3412788 (1968-11-01), Pomerantz
patent: 3836825 (1974-09-01), Hall et al.
patent: 4004195 (1977-01-01), Hacayda et al.
patent: 4340902 (1982-07-01), Honda
patent: 4415025 (1983-11-01), Horvath
AHAM, Summer 1977 catalogue.

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