Capillary for use in a wire bonding apparatus

Details Capillary for use in a wire bonding apparatus Capillary for use in a wire bonding apparatus

1997-08-21

1999-05-25

Heinrich, Samuel M.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

228 55, H01L 21603, H01L 21607

Patent

active

059063084

ABSTRACT:
A capillary for a wire bonding apparatus having a wire threading hole and a chamfer, in which the wire threading hole is formed in two stages as first and second wire threading holes, the diameter of the first wire threading hole which is located above the second wire threading hole exceeds the diameter of a bonding wire by no more than 3 to 8 microns, the diameter of the second wire threading hole is 5 to 10 microns greater than the first hole diameter, and the depth of the second wire threading hole is 10 to 50 microns.

REFERENCES:
patent: 4821944 (1989-04-01), Tsumura
patent: 4886200 (1989-12-01), Tsumura
patent: 4911350 (1990-03-01), Araki et al.
patent: 4955523 (1990-09-01), Carlommagno et al.
patent: 5421503 (1995-06-01), Perlberg et al.
patent: 5558270 (1996-09-01), Nachon et al.

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