Capillary for a wire bonding apparatus

Details Capillary for a wire bonding apparatus Capillary for a wire bonding apparatus

1997-08-21

1999-03-23

Ryan, Patrick

Metal fusion bonding

Means to apply vibratory solid-state bonding energy to work

228 45, H01L 2160, B23K 2010

Patent

active

058848304

ABSTRACT:
In a capillary used in a wire bonding apparatus that has a wire threading hole through which a bonding wire of 10 to 30 .mu.m diameter passes and is provided with two chamfers, i.e., lower and upper chamfers, near the tip end of the wire threading hole, the upper chamfer has a chamfer angle of 3 to 19 degrees and a depth of 20 to 50 microns.

REFERENCES:
patent: 3357090 (1967-12-01), Tiffany
patent: 4974767 (1990-12-01), Alfaro et al.

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