4. Metal fusion bonding
  5. Process
  6. Plural joints

Tan Kim Hwee

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Method for forming a flip chip semiconductor package

Metal fusion bonding – Process – Plural joints
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Method of assembling a package with an exposed die backside...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Package design and method of manufacture for chip grid array

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Package design and method of manufacture for chip grid array

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Semiconductor chip grid array package design and method of...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2603528

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