4. Semiconductor device manufacturing: process
  5. Bonding of plural semiconductor substrates
  6. Having enclosed cavity

Tan Hien Boon

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Die paddle enhancement for exposed pad in semiconductor...

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Having enclosed cavity
Reexamination Certificate

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Packaged device with thermal enhancement and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2462728

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