Method for removing solder bumps from LSI

Details Method for removing solder bumps from LSI Method for removing solder bumps from LSI

2008-07-22

2008-07-22

Arbes, C. J (Department: 3729)

Metal working

Method of mechanical manufacture

Disassembling

C029S426500, C029S840000, C029S843000, C228S006200

Reexamination Certificate

active

07401393

ABSTRACT:
The present invention provides a method for removing solder adhering to an LSI. In this method, a plate-shaped first member for causing molten solder to adhere thereto is mounted on top of a heater. An LSI is placed on top of the first member with the surface on which solder is attached facing downward. A second member for adding a load to the LSI is placed on top of the LSI. The heater is heated up to heat the first member and the LSI, and to melt the solder. The molten solder is transferred to the first member. A suction mechanism is positioned at a location a predetermined distance away from the top surface of the second member. The second member and the LSI are attracted by the suction mechanism, and the LSI is pulled away from the first member. The solder is thereby removed from the LSI.

REFERENCES:
patent: 6739045 (2004-05-01), Kimura et al.

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