4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor

Takeo Ogihara

Inventor

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Electronic component

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Hollow package manufacturing method

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Patent

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Infrared-blocking optical fiber

Optical: systems and elements – Having significant infrared or ultraviolet property – Multilayer filter or multilayer reflector
Patent

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Lead frame flash removing method and apparatus

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Patent

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Method of absorbing rays outside a visible region

Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Including a second component containing structurally defined...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-197662

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