Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1997-11-26
2000-01-04
Chaudhuri, Olik
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257698, 257704, H01L 2348
Patent
active
060113030
ABSTRACT:
An electronic component includes a substrate portion, a bank portion, a plurality of lead members, an anchor hole, and at least a pair of notches. A chip is supported on the substrate portion. The bank portion is formed on a periphery of the substrate portion to surround the chip. The plurality of lead members are made of conductive strip pieces, and each lead member has an inner lead electrically connected to the chip and an outer lead extending to an outside. The substrate portion and the bank portion are integrally molded with a resin to include the lead members, so that the inner and outer leads are fixed to a connecting portion between the substrate portion and the bank portion. The anchor hole is formed in a portion where each of the lead members is in contact with the bank portion, and is filled with a resin. The pair of notches are formed in two ends of each of the lead members to sandwich the anchor hole.
REFERENCES:
patent: 3683241 (1972-08-01), Duncan
patent: 5387814 (1995-02-01), Baudouin et al.
patent: 5541451 (1996-07-01), Kusumi
patent: 5574314 (1996-11-01), Okada et al.
Hirokawa Tomoaki
Ichikawa Seiji
Kimura Tomoaki
Kubota Tsutomu
Murata Satoshi
Chaudhuri Olik
NEC Corporation
Wille Douglas A.
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