Lead frame flash removing method and apparatus

Details Lead frame flash removing method and apparatus Lead frame flash removing method and apparatus

1997-02-28

1999-09-21

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

438110, 438120, 438121, H01L 2144, H01L 2148, H01L 2150

Patent

active

059565748

ABSTRACT:
In a lead frame flash removing method and apparatus, a lead frame is molded integrally with a case. After molding, abrasive agent-mixed water is sprayed to a surface of the lead frame where a flash is formed. The lead frame is dipped in an electrolytic solution and applying a DC voltage is applied across the lead frame and an electrode in the electrolytic solution, thereby electrolytically processing the lead frame. After the electrolytic process, an external force is applied to the surface of the lead frame, thereby removing the flash.

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