4. Powder metallurgy processes
  5. Powder metallurgy processes with heating or sintering
  6. Powder pretreatment

Takasi Yamanobe

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Sputtered silicide film

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
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Sputtering target and method of manufacturing the same

Powder metallurgy processes – Powder metallurgy processes with heating or sintering – Powder pretreatment
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Sputtering target and method of manufacturing the same

Specialized metallurgical processes – compositions for use therei – Compositions – Consolidated metal powder compositions
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Profile ID: LFUS-PAI-P-533971

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