4. Adhesive bonding and miscellaneous chemical manufacture
  5. Methods
  6. Surface bonding and/or assembly therefor

Takao Yoshikawa

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active

Electronic substrate, power module and motor driver

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Heat-conductive and pressure-sensitive adhesive sheets and metho

Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Adhesive outermost layer
Patent

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Heat-conductive and pressure-sensitive adhesive sheets and...

Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Adhesive outermost layer
Reexamination Certificate

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Peelable heat-conductive and pressure-sensitive adhesive and...

Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Adhesive outermost layer
Reexamination Certificate

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Photopolymerizable composition, pressure-sensitive...

Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Adhesive outermost layer
Reexamination Certificate

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Profile ID: LFUS-PAI-P-464040

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