Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate
2006-10-10
2006-10-10
Clark, S. V. (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
C257S691000
Reexamination Certificate
active
07119437
ABSTRACT:
An electronic substrate is used to mount a plurality of semiconductor chips thereon. The substrate includes a first conductive member, a second conductive member, and an insulating layer. The first conductive member is electrically connected to one of the semiconductor chips. The second conductive member is electrically connected to another one of the semiconductor chips. The insulating layer is arranged to electrically isolate the second conductive member from the first conductive member. The first conductive member is a conductive base that supports the insulating layer, the semiconductor chips and the second conductive member thereon.
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“Reduction of Circuit Inductance in Motor Controllers for Electric Vehicles”, Small Engine Technology Conference & Exhibition, Sep. 2003, Marriott Madison West, Madison, Wisconsin, USA.
Morita Koji
Murai Takayuki
Yoshikawa Takao
Clark S. V.
Yamaha Hatsudoki Kabushiki Kaisha
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