Heat-conductive and pressure-sensitive adhesive sheets and metho

Details Heat-conductive and pressure-sensitive adhesive sheets and metho Heat-conductive and pressure-sensitive adhesive sheets and metho

1998-04-16

2000-07-11

Raimund, Christopher

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

428355AC, 156332, B32B 712, B32B 1504

Patent

active

060869941

ABSTRACT:
Heat-conductive and pressure-sensitive adhesive sheets which are excellent in heat resistance, scarcely undergo anchoring fracture between the base material and the adhesive layer and, therefore, are usable in fixing electronic parts to heat-radiating members or fixing members in various fields including constructive materials, vehicles, aircrafts and ships. the heat-conductive and pressure-sensitive adhesive sheets are in the form of sheets, tapes, etc. wherein a layer of a heat-conductive and pressure-sensitive adhesive composition, which contains an alkyl (meth)acrylate polymer having hydrophilic groups, is formed on the high frequency sputter-etched surface(s) of a plastic film containing 2 to 50% by volume of a heat-conductive, electrical insulating filler.

REFERENCES:
patent: 5213868 (1993-05-01), Liberty et al.
patent: 5298791 (1994-03-01), Liberty et al.
XP-002071516 (corresponds to JPA 61-236882, published Oct. 22, 1986).
XP-002071517 (corresponds to JPA 59-091182, published May 25, 1984).
XP-002071518 (corresponds to JPA 51-119733, published Oct. 20, 1976).

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