4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame

Taebok Jung

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active

Multichip leadframe package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Multichip leadframe package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Stacked die package system

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Profile ID: LFUS-PAI-P-3026325

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