4. Metal fusion bonding
  5. Process
  6. Preplacing solid filler

Szu-Wei Lu

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Integrated process for I/O redistribution and passive...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Low CTE substrates for use with low-k flip-chip package devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Method for fabricating a semiconductor package including...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
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Method for forming fine-pitched solder bumps

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
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Method for forming solder bumps of improved height and...

Metal fusion bonding – Process – Preplacing solid filler
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Profile ID: LFUS-PAI-P-2023436

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