4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Suraj Rengarajan

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Barrier applications for aluminum planarization

Semiconductor device manufacturing: process – Including control responsive to sensed condition
Reexamination Certificate

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Barrier applications for aluminum planarization

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Ionized metal plasma Ta, TaNx, W, and WNx liners for gate...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Method and apparatus for process monitoring

Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure
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Method of depositing a TaN seed layer

Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
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Profile ID: LFUS-PAI-P-2077880

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