4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Multiple housings

Sung Jin Yang

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Increased capacity leadframe and semiconductor package using...

Etching a substrate: processes – Forming or treating electrical conductor article
Reexamination Certificate

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Manufacturing method for leadframe and for semiconductor...

Etching a substrate: processes – Forming or treating electrical conductor article
Reexamination Certificate

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Package in package semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Semiconductor package with chamfered corners and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2310175

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