Manufacturing method for leadframe and for semiconductor...

Details Manufacturing method for leadframe and for semiconductor... Manufacturing method for leadframe and for semiconductor...

2006-12-05

2006-12-05

Ahmed, Shamim (Department: 1765)

Etching a substrate: processes

Forming or treating electrical conductor article

C216S041000, C216S033000, C216S036000, C438S106000

Reexamination Certificate

active

07144517

ABSTRACT:
In accordance with the present invention, there is provided a method for manufacturing a leadframe. The method comprises the initial step of bonding a primary leadframe to an adhesive tape layer, the primary leadframe including a die paddle and a plurality of leads which extend at least partially about the die paddle in spaced relation thereto. Thereafter, a photo resist is applied to the primary leadframe and to the adhesive tape layer. The photo resist is then patterned to define at least one exposed area in each of the leads of the primary leadframe. The exposed areas of the leads are then etched to divide the leads into an inner set which extends at least partially about the die paddle and an outer set which extends at least partially about the inner set. Thereafter, the photo resist is removed from the die paddle and from the inner and outer sets of the leads.

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