4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Encapsulated
  6. With specified encapsulant

Sun Hee Hong

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Dual cure B-stageable underfill for wafer level

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate

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Underfill encapsulant for wafer packaging and method for its...

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate

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