Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2006-05-02
2006-05-02
Buttner, David (Department: 1712)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S330000, C257S793000, C428S620000, C523S466000, C528S094000, C528S103000, C528S405000, C528S407000, C528S418000, C528S419000
Reexamination Certificate
active
07037399
ABSTRACT:
A curable underfill encapsulant composition that is applied directly onto semiconductor wafers before the wafers are diced into individual chips. The composition comprises a thermally curable epoxy resin, a solvent, an imidazole-anhydride curing agent, fluxing agents, and optionally, wetting agents. Various other additives, such as defoaming agents, adhesion promoters, flow additives and rheology modifiers may also be added as desired. The underfill encapsulant is B-stageable to provide a coating on the wafer that is smooth, non-tacky and will allow the wafer to be cleanly diced into individual chips. A method for producing an electronic package containing the B-stageable material may also utilize an unfilled liquid curable fluxing material on the substrate to which the chip is to be attached.
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Hong Sun Hee
Ma Bodan
Tong Quinn K.
Xiao Yue
Almer Charles W.
Buttner David
National Starch and Chemical Investment Holding Corporation
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