4. Electricity: conductors and insulators
  5. Conduits, cables or conductors
  6. Preformed panel circuit arrangement

Sudipta Kumar Ray

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Column grid array substrate attachment with heat sink stress rel

Metal fusion bonding – Process – Plural joints
Patent

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Column grid array substrate attachment with heat sink stress...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Opto-electronic transceiver module and hermetically sealed...

Optical waveguides – With disengagable mechanical connector – Optical fiber to a nonfiber optical device connector
Reexamination Certificate

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Polymer enhanced column grid array

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Process for forming cone shaped solder for chip interconnection

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Profile ID: LFUS-PAI-P-794131

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