Column grid array substrate attachment with heat sink stress rel

Metal fusion bonding – Process – Plural joints

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

228189, 228226, B23K 3102

Patent

active

060533943

ABSTRACT:
Structure and method for reinforcing a solder column grid array attachment of a ceramic or the like substrate to a printed circuit board, the reinforcement providing support for a heat sink which is bonded or affixed by pressure to a structural element of the substrate. In one form, the invention involves the concurrent formation of materially larger solder columns along the perimeter of the substrate in conjunction with the array of thin electrically interconnecting solder columns on the substrate. The reinforcing and electrical signal columns are thereafter aligned and attached by solder reflow to a corresponding pattern of pads on the printed circuit board. The heat sink is thermally connected to a structural element of the substrate by bonding or mechanical compression. Stresses in the solder columns caused by heat sink compressive forces or vibration induced flexing are materially decreased without adding complex or unique manufacturing operations.

REFERENCES:
patent: 3871015 (1975-03-01), Lin et al.
patent: 3932934 (1976-01-01), Lynch et al.
patent: 4413308 (1983-11-01), Brown
patent: 4509096 (1985-04-01), Baldwin et al.
patent: 4604644 (1986-08-01), Beckham et al.
patent: 4664309 (1987-05-01), Allen et al.
patent: 4705205 (1987-11-01), Allen et al.
patent: 4878611 (1989-11-01), LoVasco et al.
patent: 4914814 (1990-04-01), Behun et al.
patent: 4927697 (1990-05-01), Ihill
patent: 5001829 (1991-03-01), Schelhorn
patent: 5088007 (1992-02-01), Missele
patent: 5108027 (1992-04-01), Warner et al.
patent: 5222014 (1993-06-01), Lin
patent: 5233504 (1993-08-01), Melton et al.
patent: 5251806 (1993-10-01), Agarwala et al.
patent: 5324892 (1994-06-01), Granier et al.
patent: 5349495 (1994-09-01), Visel et al.
patent: 5397921 (1995-03-01), Karnezos
patent: 5400950 (1995-03-01), Myers et al.
patent: 5498903 (1996-03-01), Dixon et al.
patent: 5541450 (1996-07-01), Jones et al.
patent: 5551627 (1996-09-01), Leicht et al.
patent: 5639696 (1997-06-01), Liang et al.
patent: 5641990 (1997-06-01), Chiu
patent: 5675183 (1997-10-01), Swamy et al.
patent: 5718367 (1998-02-01), Covell, II et al.
patent: 5821161 (1998-10-01), Covell, II et al.
patent: 5881944 (1999-03-01), Edwards et al.
patent: 5881945 (1999-03-01), Edwards et al.
IBM Technical Disclosure Bulletin, vol. 32, No. 8A, Jan. 1990, "Latchless Pneumatic Impact Actuator", pp. 483-486.
IBM Technical Disclosure Bulletin, vol. 38, No. 02, Feb. 1995, "Surface Mount Heat Sink for Solder Ball Connect Modules and C4 Chip to Card Attach", p. 419.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Column grid array substrate attachment with heat sink stress rel does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Column grid array substrate attachment with heat sink stress rel, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Column grid array substrate attachment with heat sink stress rel will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-986984

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.