Metal fusion bonding – Process – Plural joints
Patent
1998-01-13
2000-04-25
Ryan, Patrick
Metal fusion bonding
Process
Plural joints
228189, 228226, B23K 3102
Patent
active
060533943
ABSTRACT:
Structure and method for reinforcing a solder column grid array attachment of a ceramic or the like substrate to a printed circuit board, the reinforcement providing support for a heat sink which is bonded or affixed by pressure to a structural element of the substrate. In one form, the invention involves the concurrent formation of materially larger solder columns along the perimeter of the substrate in conjunction with the array of thin electrically interconnecting solder columns on the substrate. The reinforcing and electrical signal columns are thereafter aligned and attached by solder reflow to a corresponding pattern of pads on the printed circuit board. The heat sink is thermally connected to a structural element of the substrate by bonding or mechanical compression. Stresses in the solder columns caused by heat sink compressive forces or vibration induced flexing are materially decreased without adding complex or unique manufacturing operations.
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Dockerty Robert Charles
Fraga Ronald Maurice
Ramirez Ciro Neal
Ray Sudipta Kumar
Robbins Gordon Jay
International Business Machines - Corporation
Ryan Patrick
Salys Casimer K.
Stoner Kiley
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