Steven R. Boyle

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Bonding pad scheme

Patent

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EMI heatspreader/lid for integrated circuit packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Integrated temperature sensor

Thermal measuring and testing – Temperature measurement – By electrical or magnetic heat sensor
Reexamination Certificate

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Method and system for monitoring and profiling an integrated...

Data processing: measuring – calibrating – or testing – Measurement system – Temperature measuring system
Reexamination Certificate

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Method of making a multi-layer to package

Metal working – Method of mechanical manufacture – Electrical device making
Patent

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Profile ID: LFUS-PAI-P-40119

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