4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Flip chip

Stephen Kilpatrick

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Dual-solder flip-chip solder bump

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
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Immersion plating and plated structures

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
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Immersion plating and plated structures

Coating processes – Immersion or partial immersion – Metal base
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Interconnections for flip-chip using lead-free solders and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Interconnections for flip-chip using lead-free solders and...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Profile ID: LFUS-PAI-P-2292251

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