Immersion plating and plated structures

Details Immersion plating and plated structures Immersion plating and plated structures

2006-05-02

2006-05-02

Zimmerman, John J. (Department: 1775)

Coating processes

Immersion or partial immersion

Metal base

C427S443100, C420S562000, C420S557000, C428S615000, C428S646000, C428S620000, C428S936000

Reexamination Certificate

active

07037559

ABSTRACT:
A first metal is plated onto a substrate comprising a second metal by immersing the substrate into a bath comprising a compound of the first metal and an organic diluent. The second metal is more electropositive than the first metal. The organic diluent has a boiling point higher than a eutectic point in a phase diagram of the first and second metals. The bath is operated above the eutectic point but below the melting point of the second metal. For example, bismuth is immersion plated onto lead-free tin-based solder balls, and subsequently redistributed by fluxless reflow. Plated structures are also provided.

REFERENCES:
patent: 5160422 (1992-11-01), Nishimura et al.
patent: 5196053 (1993-03-01), Dodd et al.
patent: 5435838 (1995-07-01), Melton et al.
patent: 5554211 (1996-09-01), Bokisa et al.
patent: 5631091 (1997-05-01), Piano
patent: 5813870 (1998-09-01), Gaynes et al.
patent: 5876795 (1999-03-01), Goldsmith et al.
patent: 6063172 (2000-05-01), Bokisa et al.
patent: 6090493 (2000-07-01), Piano
patent: 6300164 (2001-10-01), Call et al.
patent: 6433425 (2002-08-01), Sarkhel
patent: 6447980 (2002-09-01), Rahman et al.
patent: 6465161 (2002-10-01), Kang et al.
patent: 6478944 (2002-11-01), Ishiyama
patent: 6680128 (2004-01-01), Mei
“Lead-Free Tim Alloys-Laboratory Curiosities or Capable Processes?” by Manfred Jordan, Metal Finishing, Jan. 2003.
“Modern Aspects of Electrochemistry No. 35”, edited by Brian E. Conway and Ralph E. White, chapter 2, “Electroless Deposition of Metals and Alloys”, Djokic, pp. 51, 54, 55, 116-119.
“Electroplating” by Frederick Adolph Lowenheim, 1978, chapter 18, pp. 410-415.
“Tin Pest in Lead-Free Solders”, Karlya et al., Soldering & Surface Mount Technology, 13/1, 2000, pp. 39-40.

Affiliated with

Also associated with

Rating

Immersion plating and plated structures does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Immersion plating and plated structures, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Immersion plating and plated structures will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3575313