4. Metal fusion bonding
  5. Process
  6. Plural joints

Stephen Babinetz

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Method and apparatus for forming bumps for semiconductor...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Methods for forming conductive bumps and wire loops

Metal fusion bonding – Process – Plural joints
Reexamination Certificate

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Profile ID: LFUS-PAI-P-3042406

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