Methods for forming conductive bumps and wire loops

Details Methods for forming conductive bumps and wire loops Methods for forming conductive bumps and wire loops

2007-03-13

2007-03-13

Edmondson, Lynne R. (Department: 1725)

Metal fusion bonding

Process

Plural joints

C228S004500, C228S110100

Reexamination Certificate

active

11222300

ABSTRACT:
A method of forming a conductive bump is provided. The method includes depositing a conductive bump on a bonding location using a bonding tool such that a junction exists between (1) a length of wire extending at least partially within the bonding tool and (2) the deposited conductive bump. The method also includes moving the bonding tool to contact the conductive bump such that a location of the junction is moved with respect to the bonding location.

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