4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Alignment marks

Stanley C. Beddingfield

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Bumped semiconductor device with alignment features and method f

Active solid-state devices (e.g. – transistors – solid-state diode – Alignment marks
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Process for underfilling a flip-chip semiconductor device

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
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Profile ID: LFUS-PAI-P-281079

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