Process for underfilling a flip-chip semiconductor device

Details Process for underfilling a flip-chip semiconductor device Process for underfilling a flip-chip semiconductor device

1995-12-04

1998-01-20

Niebling, John

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

438127, 438126, 257778, H01L 2160

Patent

active

057100713

ABSTRACT:
A flip-chip semiconductor device (70) is formed by mounting a semiconductor die (20) to a wiring substrate (30). The wiring substrate includes a hole (39). An underfill encapsulation material (52) is dispensed around an entire perimeter of the semiconductor die. The underfill encapsulation material then flows toward the center of the die, expelling any trapped air through hole (39) of the wiring substrate to avoid voiding. By providing a method which utilizes an entire perimeter dispense, manufacturing time of the underfilling step is significantly reduced. At the same time, a uniform fillet is formed and the formation of voids in the underfill encapsulation material is avoided due to the presence of hole (39) in the wiring substrate. Multiple die (100) can also be underfilled using a single dispensing operation in accordance with the invention.

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C.E. Park et al.; "Evaulation of Epoxy Underfill Materials for Use in Chip-on-Board Method of Packaging Silicon Integrated Circuits;" Annual Technical Conf. Proceedings; pp. 2871-2876, (1995).
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