4. Cleaning and liquid contact with solids
  5. Processes
  6. For metallic, siliceous, or calcareous basework, including...

St Assembly Test Services Pte Ltd

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Boat and assembly method for ball grid array packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
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Die paddle enhancement for exposed pad in semiconductor...

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Having enclosed cavity
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Heat spreader hole pin 1 identifier

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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High volume fluid head

Cleaning and liquid contact with solids – Processes – For metallic – siliceous – or calcareous basework – including...
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Testing of BGA and other CSP packages using probing techniques

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
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