4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Srinivas Gandikota

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Continuous, non-agglomerated adhesion of a seed layer to a...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Electro-chemical polishing apparatus

Electrolysis: processes – compositions used therein – and methods – Electrolytic erosion of a workpiece for shape or surface... – Local application of electrolyte
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Electroless deposition method

Etching a substrate: processes – Mechanically shaping – deforming – or abrading of substrate
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Electroless deposition method

Etching a substrate: processes – Mechanically shaping – deforming – or abrading of substrate
Reexamination Certificate

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Electroless deposition method over sub-micron apertures

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Forming nonelectrolytic coating before depositing...
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Profile ID: LFUS-PAI-P-2398506

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