4. Metal working
  5. Method of mechanical manufacture
  6. Electrical device making

Soon-Cheon Seo

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Bilayer HDP CVD/PE CVD cap in advance BEOL interconnect...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Bilayer HDP CVD/PE CVD cap in advanced BEOL interconnect...

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Channel stop layer
Reexamination Certificate

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Chip to wiring interface with single metal alloy layer...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Chromium adhesion layer for copper vias in low-k technology

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Electroplated copper interconnection structure, process for...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2583633

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