4. Metal fusion bonding
  5. Process
  6. Plural joints

Sohichi Kadoguchi

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active

Semiconductor packages and methods for manufacturing such...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

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Spot heat wirebonding

Metal fusion bonding – Process – Plural joints
Reexamination Certificate

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Wire bonds having pressure-absorbing balls

Metal fusion bonding – Process – Plural joints
Reexamination Certificate

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Wire bonds having pressure-absorbing balls

Metal fusion bonding – Process – Plural joints
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2178407

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