Spot heat wirebonding

Details Spot heat wirebonding Spot heat wirebonding

2011-04-19

2011-04-19

Stoner, Kiley (Department: 1735)

Metal fusion bonding

Process

Plural joints

C228S004500, C228S110100

Reexamination Certificate

active

07926698

ABSTRACT:
Methods and systems are disclosed for forming secure wirebonds between electrical contacts in electronic device assemblies. Representative embodiments of the invention are described for forming a wirebond including system components and method steps for generating electromagnetic energy from a heat source and transmitting heat to a ball formed on a bondwire. Subsequently, pressure applied to the ball at the bonding site is used in the formation of a wirebond.

REFERENCES:
patent: 4315128 (1982-02-01), Matcovich et al.
patent: 4821944 (1989-04-01), Tsumura
patent: 5957371 (1999-09-01), Miyano et al.
patent: 6031216 (2000-02-01), Singh et al.
patent: 2002/0027151 (2002-03-01), Arakawa
patent: 2002/0027152 (2002-03-01), Ushiki et al.
patent: 2006/0219754 (2006-10-01), Clauberg et al.
patent: 5-226402 (1993-09-01), None

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