4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Bump leads

Sidney Larry Anderson

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Integrated circuit package utilizing a conductive structure...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Method of fabricating an integrated circuit package...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
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Semiconductor package with improved thermal cycling...

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2550147

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