Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2005-08-16
2005-08-16
Chambliss, Alonzo (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S612000, C438S613000, C029S874000
Reexamination Certificate
active
06929978
ABSTRACT:
An integrated circuit package is provided with a ball landing area having a conductive structure for interlocking a conductive ball to the ball pad. The conductive structure improves the attachment strength between an integrated circuit package and an printed circuit board. In an exemplary embodiment, the locking structure is a conductive material added to the surface of the ball pad to provide a nonplanar interface, such as a dome or a step, which interlocks the conductive ball to the ball pad. The improved package construction increases the area of contact, moves the shear plane to a higher and larger portion on the conductive ball, and/or prevents a crack from propagating along a flat plane across the ball joint. This package construction maintains the small size of the ball land areas and the package, increases the life of the integrated circuit package, while offsetting the problem of package warpage.
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S.J. Kim et al., “A Study of High Density and Reliability BGA Package with Solder Ball Lands of Oval Type”.
Altera Corporation
Chambliss Alonzo
Townsend and Townsend / and Crew LLP
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