4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With contact or lead

Shu Jung Ma

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active

Ball grid array semiconductor package and substrate therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Substrate having specific pad distribution

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Substrate having specific pad distribution

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2435825

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