Encapsulant of epoxy resin, curing agent, and secondary...

Details Encapsulant of epoxy resin, curing agent, and secondary... Encapsulant of epoxy resin, curing agent, and secondary...

2005-10-28

2009-06-09

Sellers, Robert (Department: 1796)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

C523S457000, C523S458000, C523S466000, C525S481000, C525S486000, C525S507000, C257S793000, C438S127000

Reexamination Certificate

active

07544727

ABSTRACT:
An encapsulating epoxy resin molding material comprising (A) an epoxy resin, (B) a curing agent, and (C) a silane coupling agent having a secondary amino group or (D) a phosphate, and semiconductor devices encapsulated therein.The encapsulating epoxy resin molding material for thin semiconductor devices according to this invention is excellent in fluidity, and the semiconductor device encapsulated therein, which is a semiconductor device having a semiconductor chip arranged on a thin, multi-pin, long wire, narrow-pad-pitch, or on a mounted substrate such as organic substrate or organic film, is free of molding defects such as wire sweep, voids etc. as shown in the Examples, and thus its industrial value is significant.

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